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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9555604 B1

PDFFull Text
Date of Patent:
Jan. 31, 2017

Filed:

Dec. 28, 2011

Resin composition and bonded composite

Applicants:

Yuma Irisa, Ube, JP;

Shuichi Maeda, Ube, JP;

Inventors:

Yuma Irisa, Ube, JP;

Shuichi Maeda, Ube, JP;

Assignee:

UBE INDUSTRIES, LTD., Yamaguchi, JP;

Attorney:

Buchanan, Ingersoll & Rooney PC

Primary Examiner:

Walter B Aughenbaugh

Int. Cl.
CPC ...
B32B 27/34 (2006.01); B32B 27/28 (2006.01); B32B 1/02 (2006.01); C08G 69/08 (2006.01); C08G 69/14 (2006.01); C08G 69/10 (2006.01); C08G 69/36 (2006.01); C08G 69/40 (2006.01); C09J 177/02 (2006.01); C09J 177/06 (2006.01); B32B 1/08 (2006.01); B32B 7/10 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B32B 1/02 (2013.01); B32B 1/08 (2013.01); B32B 7/10 (2013.01); B32B 27/285 (2013.01); B32B 27/34 (2013.01); C08G 69/08 (2013.01); C08G 69/10 (2013.01); C08G 69/14 (2013.01); C08G 69/36 (2013.01); C08G 69/40 (2013.01); C08G 73/105 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C09J 177/02 (2013.01); C09J 177/06 (2013.01); B32B 2605/08 (2013.01); B32B 2605/18 (2013.01); Y10T 428/1352 (2015.01); Y10T 428/1393 (2015.01); Y10T 428/24628 (2015.01); Y10T 428/31721 (2015.04);
Abstract

A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.

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