The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Nov. 05, 2015
Coretech System Co., Ltd., Hsinchu County, TW;
Yuing Chang, Hsinchu County, TW;
Rong Yeu Chang, Hsinchu County, TW;
Chia Hsiang Hsu, Hsinchu County, TW;
Chuan Wei Chang, Hsinchu County, TW;
Ching Chang Chien, Hsinchu County, TW;
Hsien Sen Chiu, Hsinchu County, TW;
CORETECH SYSTEM CO., LTD., Hsinchu, TW;
Abstract
A method for operating a molding machine includes steps of specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine; performing a virtual molding by using an initial packing pressure profile to generate an initial state waveform expressing a relationship between an in-mold pressure and an in-mold temperature of the molding resin; obtaining an updated packing pressure profile for applying a molding pressure to at least a portion of the genuine domain while taking into consideration the initial state waveform; repeating the virtual molding while taking into consideration the updated packing pressure profile to generate an updated state waveform of the molding resin; and setting the molding machine taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.