The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Nov. 19, 2014
Applicant:

Diamond Innovations, Inc., Worthington, OH (US);

Inventor:

Abhijit Prabhakar Suryavanshi, Columbus, OH (US);

Assignee:

DIAMOND INNOVATIONS, INC., Worthington, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/06 (2006.01); E21B 10/567 (2006.01); B24D 3/06 (2006.01); B22F 5/00 (2006.01); B24D 99/00 (2010.01); C22C 26/00 (2006.01); E21B 10/573 (2006.01); B01J 3/06 (2006.01); B24D 18/00 (2006.01);
U.S. Cl.
CPC ...
B24D 3/06 (2013.01); B01J 3/062 (2013.01); B22F 5/00 (2013.01); B22F 7/06 (2013.01); B24D 18/0009 (2013.01); B24D 99/005 (2013.01); C22C 26/00 (2013.01); E21B 10/567 (2013.01); E21B 10/573 (2013.01); B01J 2203/062 (2013.01); B01J 2203/063 (2013.01); B01J 2203/0655 (2013.01); B01J 2203/0685 (2013.01);
Abstract

A cutting element include a substrate and a diamond compact including at least two polycrystalline diamond portions separated by at least one metal carbide foil portion. The cutting element is made by placing diamond powder in a reaction container, placing a thin metal layer in the reaction container above or around the diamond powder and binder, placing additional diamond powder in the reaction container above or around the thin metal layer, and placing a pre-sintered substrate containing binder into the reaction container above all diamond powder and thin metal layer components. The assembled reaction container is put into a reactor and is subjected to a high-temperature high-pressure sintering process. The binder in the pre-sintered substrate sweeps through to sinter the first diamond portion, and then reacts with the thin metal layer to form a metal carbide, and then the binder continues to sweep through to sinter the second diamond portion.


Find Patent Forward Citations

Suryavanshi, Abhijit. (2017). Incorporation of bulk metal foils to increase toughness of polycrystalline diamond (U.S. Patent No. 9555519). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9555519

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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