The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Dec. 24, 2013
Applicants:

E Ink Corporation, Billerica, MA (US);

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Guy M. Danner, Somerville, MA (US);

Valerie C. Northrop, Waltham, MA (US);

Jonathan D. Albert, Philadelphia, PA (US);

Holly G. Gates, Somerville, MA (US);

Erik van Veenendaal, Eindhoven, NL;

Fredericus J. Touwslager, Veidhoven, NL;

Assignees:

E Ink Corporation, Billerica, MA (US);

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); B32B 37/02 (2006.01); B32B 37/12 (2006.01); B32B 38/10 (2006.01); B32B 38/04 (2006.01); G02F 1/167 (2006.01); H05K 13/00 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0023 (2013.01); B32B 37/02 (2013.01); B32B 38/10 (2013.01); B32B 37/12 (2013.01); B32B 38/0004 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/202 (2013.01); G02F 1/167 (2013.01); Y10T 29/49124 (2015.01); Y10T 156/109 (2015.01); Y10T 156/1052 (2015.01); Y10T 156/1057 (2015.01); Y10T 156/1062 (2015.01);
Abstract

An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.


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