The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Apr. 18, 2014
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Cary C. Kyhl, Waltham, MA (US);

Scott M. Heston, Waltham, MA (US);

James M. Elliott, Waltham, MA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 3/34 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H05K 3/303 (2013.01); H05K 3/321 (2013.01); H05K 3/3426 (2013.01); H05K 3/305 (2013.01); H05K 2201/1056 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10689 (2013.01); Y02P 70/613 (2015.11);
Abstract

A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.


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