The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Nov. 10, 2011
Applicants:

Tina Wright, County Durham, GB;

Xavier Bories-azeau, Barcelona, ES;

Inventors:

Tina Wright, County Durham, GB;

Xavier Bories-Azeau, Barcelona, ES;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 1/02 (2006.01); B32B 27/20 (2006.01); B32B 27/36 (2006.01); H01B 1/22 (2006.01); H01B 13/00 (2006.01); B05D 3/02 (2006.01); B05D 1/26 (2006.01); C23C 18/12 (2006.01); B05D 5/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); B32B 27/20 (2013.01); B32B 27/36 (2013.01); H01B 1/22 (2013.01); H01B 13/0036 (2013.01); B05D 1/265 (2013.01); B05D 3/02 (2013.01); B05D 5/063 (2013.01); B32B 2307/202 (2013.01); B32B 2307/416 (2013.01); B32B 2457/12 (2013.01); B32B 2457/14 (2013.01); B32B 2457/202 (2013.01); C23C 18/1262 (2013.01);
Abstract

A process for the manufacture of a reflective conductive film comprising: (i) a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer, wherein the polymeric material of the base layer has a softening temperature T, and the polymeric material of the binding layer has a softening temperature T; and (ii) a conductive layer comprising a plurality of nanowires, wherein said nanowires are bound by the polymeric matrix of the binding layer such that the nanowires are dispersed at least partially in the polymeric matrix of the binding layer, said process comprising the steps of providing a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer; disposing said nanowires on the exposed surface of the binding layer; and heating the composite film to a temperature Twherein Tis equal to or greater than TS−HS, and Tis at least about 5° C. below T.


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