The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Mar. 31, 2014
Applicant:

Ledengin, Inc., San Jose, CA (US);

Inventor:

Xiantao Yan, Palo Alto, CA (US);

Assignee:

LedEngin, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H05K 1/02 (2006.01); F21K 99/00 (2016.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); F21K 9/00 (2013.01); H05K 1/0313 (2013.01); H05K 1/112 (2013.01); H05K 1/181 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality of light devices. External electrical contacts are disposed on an exterior surface of the substrate. Electrical paths connect the top-side electrical contacts to the external electrical contacts. At least portions of some of the electrical paths are disposed between the electrically insulating base layers. The electrical paths can be arranged such that different subsets of the light device pads are addressable independently of each other. A heat dissipation plate can be formed on the bottom surface of a bottom one of the base layers.


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