The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
May. 17, 2012
Applicants:
Johnathan S. Coursey, Rockville, MD (US);
Kenton C. Hasson, Germantown, MD (US);
Inventors:
Johnathan S. Coursey, Rockville, MD (US);
Kenton C. Hasson, Germantown, MD (US);
Assignee:
Canon U.S. Life Sciences, Inc., Rockville, MD (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); H05B 1/02 (2006.01); F25B 29/00 (2006.01); B01L 7/00 (2006.01);
U.S. Cl.
CPC ...
H05B 1/0297 (2013.01); B01L 3/5027 (2013.01); B01L 7/52 (2013.01); F25B 29/00 (2013.01); B01L 2200/147 (2013.01); B01L 2200/148 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/1827 (2013.01); B01L 2300/1844 (2013.01); B01L 2300/1894 (2013.01); Y10T 436/143333 (2015.01);
Abstract
The present invention relates to methods and systems that result in high quality, reproducible, thermal melt analysis on a microfluidic platform. The present invention relates to methods and systems using thermal systems including heat spreading devices, including interconnection methods and materials developed to connect heat spreaders to microfluidic devices. The present invention also relates to methods and systems for controlling, measuring, and calibrating the thermal systems of the present invention.