The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Apr. 22, 2014
Applicant:

University of Florida Research Foundation, Inc., Gainesville, FL (US);

Inventors:

Mark Sheplak, Gainesville, FL (US);

David Patrick Arnold, Gainesville, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 19/04 (2006.01); H05K 1/16 (2006.01); H04R 1/04 (2006.01); H04R 31/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 1/04 (2013.01); H04R 31/003 (2013.01); H05K 1/16 (2013.01); H04R 2201/02 (2013.01); H04R 2201/029 (2013.01); H04R 2231/00 (2013.01); H04R 2400/00 (2013.01); H05K 1/0272 (2013.01); H05K 1/185 (2013.01); H05K 2201/10083 (2013.01); Y10T 29/49005 (2015.01); Y10T 29/49226 (2015.01);
Abstract

A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.


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