The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Nov. 26, 2013
Applicant:

Samsung Electronics Co., Ltd, Suson-si, Gyeonggi-do, KR;

Inventors:

Dong-Hun Yi, Asan-si, KR;

Jong-Keun Jeon, Cheonan-si, KR;

Yong-Jin Lee, Cheonan-si, KR;

Kee-Seok Kim, Cheonan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01);
Abstract

An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module.


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