The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Aug. 29, 2014
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Akihiro Hara, Kyoto, JP;

Masahiko Ura, Kyoto, JP;

Takahiro Watanabe, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/44 (2006.01); H04B 1/00 (2006.01); H05K 1/02 (2006.01); H04B 1/40 (2015.01); H04B 1/02 (2006.01); H05K 3/46 (2006.01); H04W 88/06 (2009.01);
U.S. Cl.
CPC ...
H04B 1/006 (2013.01); H04B 1/40 (2013.01); H05K 1/0216 (2013.01); H04W 88/06 (2013.01); H05K 1/0243 (2013.01); H05K 3/4629 (2013.01); H05K 2201/09972 (2013.01);
Abstract

Provided is a technique capable of improving isolation characteristics between a plurality of signal paths through which RF signals pass, without using ground electrodes or the like. Wiring electrodesandthrough which RF signals do not pass simultaneously are formed so as to be adjacent to each other in a central region of a component mounting surfaceof a circuit board, and wiring electrodesandthrough which RF signals pass simultaneously are formed so as to be distanced from transmission pathsand. Accordingly, the RF signals do not simultaneously pass through the transmission pathsand, which are disposed near each other, and thus there is no risk that the RF signal passing through one of the signal paths will interfere with the RF signal passing through the other signal path.


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