The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Sep. 26, 2016
Showa Denko Packaging Co., Ltd., Isehara-shi, Kanagawa, JP;
Tetsunobu Kuramoto, Isehara, JP;
Yuuji Minamibori, Isehara, JP;
SHOWA DENKO PACKAGING CO., LTD., Kanagawa, JP;
Abstract
Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer () comprising a heat resistant resin; an inside sealant layer () comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (). A matte coat layer () comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer (), and the gloss value of the surface thereof is suppressed to no greater than 30%.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile