The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Sep. 13, 2012
Applicants:
Takaaki Kudo, Tokyo, JP;
Naofumi Ikenaga, Tokyo, JP;
Tetsu Urano, Tokyo, JP;
Inventors:
Assignee:
JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 24/97 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0033 (2013.01);
Abstract
A semiconductor device package assembly which increases production efficiency of semiconductor devices by enabling the number of semiconductor device packages held by a carrier to be increased. A predetermined area of a first housing molded of white-colored resin, which holds a plurality of bent contacts, is covered by a second housing molded of black-colored resin, and a plurality of second housings are supported by a secondary molding carrier in high density. A linking portion of each contact and one or both of the first and second housings are integrated by insert molding.