The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Jun. 09, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masao Ishioka, Tokyo, JP;

Nobutaka Ukigaya, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/0203 (2014.01); H01L 27/146 (2006.01); H01L 31/18 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 27/14632 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 31/1868 (2013.01); H01L 2223/54446 (2013.01); H01L 2223/54453 (2013.01);
Abstract

A method of manufacturing a semiconductor device is provided. The method includes forming a passivation film on a substrate including a first element region, a second element region adjacent to the first element region in a first direction, a third element region adjacent to the first region in a second direction, and a first scribe region extending to the first direction between the first element region and the third element region, forming a first trench in the passivation film between the first scribe region and the first element region, forming a second trench in the passivation film between the third element region and the first scribe region, and forming a film on the passivation film where the trenches have been formed by coating. The each of trenches is formed continuously along the first and the second element region.


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