The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Jan. 30, 2015
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Akinobu Onishi, Ota, JP;
Takashi Oomikawa, Fujioka, JP;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
In accordance with an embodiment, a semiconductor component and a method for manufacturing a semiconductor component are provided. A first dielectric material is formed over a body of semiconductor material of the first conductivity type and a plurality of semiconductor fingers are formed over the first of dielectric material. Semiconductor fingers of the plurality of semiconductor fingers spaced apart from each other and at least one of the semiconductor fingers has a first end spaced apart from a second end by a central region. A second dielectric material is formed over central region of the at least one semiconductor finger of the plurality of semiconductor fingers. An electrically conductive material is formed over the second dielectric material that is over the central region of the at least one semiconductor finger. The electrically conductive material serves as a shielding structure and the semiconductor material may be coupled to a fixed potential.