The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
May. 31, 2013
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Boris Eichenberg, Schierling, DE;
Jürgen Holz, Wenzenbach, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 9/16 (2006.01); H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); F21S 8/10 (2006.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); F21S 48/115 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/505 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0091 (2013.01);
Abstract
A light-emitting diode module includes a carrier and a plurality of optoelectronic semiconductor chips mounted on a carrier top and configured to generate primary radiation. The semiconductor chips are arranged in part at a first distance and in part at a second, greater distance from one another. Between the adjacent semiconductor chips arranged at the first distance from one another there is located a radiation-transmissive first filling for optical coupling. Between the adjacent semiconductor chips arranged at the second distance from one another there is located a radiation-opaque second filling for optical isolation.