The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Feb. 26, 2016
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Yoshihide Matsuo, Chino, JP;
Masashi Yoshiike, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/13644 (2013.01);
Abstract
An electronic device includes a drive substrate (a pressure chamber substrate and a vibration plate) including a piezoelectric element and electrode wirings related to driving of the piezoelectric element formed thereon, and a sealing plate bonded thereto, the electrode wirings are made of wiring metal containing gold (Au) on the drive substrate through an adhesion layer which is a base layer, and has a removed portion in which a portion of the wiring metal in a region containing a part bonded to a bonding resin is removed and the adhesion layer is exposed.