The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Mar. 03, 2016
Applicant:

J-metrics Technology Co., Ltd., Taipei, TW;

Inventors:

Chen-Chih Fan, Taipei, TW;

Wei-Ting Lin, Taipei, TW;

Shih-Chun Kuo, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 29/82 (2006.01); H01L 29/84 (2006.01); H01L 23/00 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); G06K 9/0002 (2013.01); H01L 2224/02372 (2013.01);
Abstract

A fingerprint identification device includes a first dielectric layer, a fingerprint sensing chip, a packaging layer, a first redistribution layer, a second dielectric layer, a second redistribution layer, and a third dielectric layer. The fingerprint sensing chip is disposed on the first dielectric layer and has a sensing transmission pad. The packaging layer defines a first via hole and covers the first dielectric layer and fingerprint sensing chip. Disposed on the packaging layer, the first redistribution layer contacts a drive transmission pad via the first via hole. The second dielectric layer defines a second via hole and covers the packaging layer and the first redistribution layer. Disposed on the second dielectric layer, the second redistribution layer defines a looped pattern, in addition to connect electrically with the first redistribution layer via the second via hole. The third dielectric layer covers the second dielectric layer and second redistribution layer.


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