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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9553022 B1

PDFFull Text
Date of Patent:
Jan. 24, 2017

Filed:

Jul. 06, 2015

Method for use in manufacturing a semiconductor device die

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Michaela Braun, Regensburg, DE;

Markus Menath, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Marvin Payen

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/3065 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 22/34 (2013.01); H01L 23/3121 (2013.01); H01L 2221/68327 (2013.01);
Abstract

In one embodiment, a wafer includes a number of die areas each including a semiconductor device and dedicated to become a separate die. The die areas are disposed on a first face of the wafer and wherein adjacent die areas are distanced from one another. A first trench and a second trench are formed on the first face between adjacent die areas. The first trench and the second trench are spaced apart from one another by a ridge. A third trench is disposed above the ridge on a second face of the wafer.

Find Patent Forward Citations

Braun, Michaela. (2017). Method for use in manufacturing a semiconductor device die (U.S. Patent No. 9553022). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9553022

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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