The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Oct. 09, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;

Inventors:

Koji Fujimoto, Nagaokakyo, JP;

Emi Matsushita, Nagaokakyo, JP;

Hitoshi Kuromi, Nagaokakyo, JP;

Taro Ueno, Nagaokakyo, JP;

Yoshihiro Koshido, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01); H01G 9/042 (2006.01); H01G 9/15 (2006.01); H01G 13/00 (2013.01); H01G 9/055 (2006.01);
U.S. Cl.
CPC ...
H01G 9/0032 (2013.01); H01G 9/0425 (2013.01); H01G 9/055 (2013.01); H01G 9/15 (2013.01); H01G 13/00 (2013.01); Y10T 29/417 (2015.01);
Abstract

A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.


Find Patent Forward Citations

Loading…