The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Mar. 10, 2014
Applicant:

Omron Automotive Electronics Co., Ltd., Aichi, JP;

Inventors:

Koji Hachiya, Hyoto, JP;

Tomoyoshi Kobayashi, Aichi, JP;

Takashi Yamaguchi, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/08 (2006.01); H01F 27/28 (2006.01); H01F 27/22 (2006.01); H01F 37/00 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2876 (2013.01); H01F 27/22 (2013.01); H01F 27/2804 (2013.01); H01F 37/00 (2013.01); H05K 1/165 (2013.01); H01F 2027/2819 (2013.01); H05K 1/0204 (2013.01); H05K 1/0263 (2013.01); H05K 3/0061 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10416 (2013.01);
Abstract

Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.


Find Patent Forward Citations

Loading…