The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Jan. 07, 2016
Applicant:

Pmc-sierra Us, Inc., Sunnyvale, CA (US);

Inventor:

Daniel Kim, Port Moody, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/30 (2006.01); H01L 25/16 (2006.01); G02B 6/13 (2006.01); G02B 6/138 (2006.01); G02B 6/43 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/42 (2013.01); G02B 6/13 (2013.01); G02B 6/138 (2013.01); G02B 6/30 (2013.01); G02B 6/4224 (2013.01); G02B 6/4249 (2013.01); G02B 6/43 (2013.01); H01L 25/167 (2013.01); G02B 2006/12197 (2013.01);
Abstract

The present disclosure relates to a method for manufacturing one or more optical engine packages, each optical engine package comprising a silicon photonic die. The method includes receiving a substrate comprising a package portion and a cutting area adjacent to the package portion, assembling the optical engine package on the substrate such that an edge-coupled waveguide of the silicon photonic die overlaps a boundary between the cutting area and the package portion, and cutting the optical engine package and the substrate in the cutting area to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.


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