The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Feb. 24, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hajime Akiyama, Tokyo, JP;

Akira Okada, Tokyo, JP;

Kinya Yamashita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 21/68 (2006.01); G01B 11/14 (2006.01); G01B 11/30 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2891 (2013.01); H01L 21/681 (2013.01); G01B 11/14 (2013.01); G01B 11/30 (2013.01); G01R 31/2831 (2013.01);
Abstract

A semiconductor device assessment apparatus that electrically assesses a semiconductor device formed on a semiconductor substrate includes a holding unit having a surface to hold the semiconductor substrate thereon, and a detection unit to detect irregularity on the surface of the holding unit. The holding unit on the surface includes a plurality of grooves formed such that when the semiconductor substrate is held on the surface, the grooves overlap a periphery of the semiconductor substrate and also have a portion located outer than the periphery of the semiconductor substrate.


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