The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Sep. 04, 2014
Applicant:

Toshiba Home Technology Corporation, Niigata, JP;

Inventors:

Osamu Honmura, Niigata, JP;

Nobuyuki Kojima, Niigata, JP;

Naoto Sakuma, Niigata, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); G06F 1/20 (2006.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0233 (2013.01); F28D 15/046 (2013.01); G06F 1/203 (2013.01); F28D 15/0266 (2013.01);
Abstract

Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.


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