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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9550922 B1

PDFFull Text
Expired
Date of Patent:
Jan. 24, 2017

Filed:

Oct. 24, 2014

Hot-melt adhesive for electric instruments

Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Itsuro Tomatsu, Osaka, JP;

Kenji Matsuda, Osaka, JP;

Ai Takamori, Osaka, JP;

Assignee:

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

Attorney:

Sun Hee Lehmann

Primary Examiner:

Jeffrey Mullis

Int. Cl.
CPC ...
C09J 123/12 (2006.01); C09J 123/26 (2006.01); H01L 31/048 (2014.01); C09J 153/00 (2006.01); C09J 151/06 (2006.01); H01M 2/08 (2006.01);
U.S. Cl.
CPC ...
C09J 123/26 (2013.01); C09J 123/12 (2013.01); C09J 151/06 (2013.01); C09J 153/00 (2013.01); H01M 2/08 (2013.01); C09J 2203/33 (2013.01);
Abstract

There are provided a hot-melt adhesive, which is excellent in solvent resistance and is excellent in adhesion to an adherend (specifically, a polyimide film) containing an electrolytic solution of a battery therein, and also can contribute to an improvement in performances of electric instruments; and an electric instrument produced by using such hot-melt adhesive. A hot-melt adhesive for electric instruments, comprising an olefin based modified polymer (A), the olefin based modified polymer (A) being a modified polymer having a functional group containing silicon, is excellent in resistance to an electrolytic solution of a battery (that is, electrolytic solution resistance or solvent resistance), and also exhibits improved adhesion of the hot-melt adhesive to an adherend (plastic film such as a polyimide film) containing the electrolytic solution therein.

Find Patent Forward Citations

Tomatsu, Itsuro. (2017). Hot-melt adhesive for electric instruments (U.S. Patent No. 9550922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9550922

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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