The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Mar. 10, 2015
Mitsubishi Chemical Corporation, Tokyo, JP;
Takumi Watanabe, Yokohama, JP;
Masato Andou, Yokohama, JP;
Toshiyuki Tanaka, Yokohama, JP;
Akinori Kimura, Yokohama, JP;
Nobuhiko Ueno, Tokyo, JP;
Maki Saito, Yokohama, JP;
Phuong Thi Kim Dao, Yokohama, JP;
Tetsuo Kasai, Yokohama, JP;
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Abstract
The present invention is directed to provide at least one of a novel thermosetting resin composition using an epoxy compound, a method for producing the composition, a method for producing a novel cured resin using an epoxy compound, and a novel method for causing self-polymerization of an epoxy compound. The thermosetting resin composition includes an epoxy compound, a gallium compound, and a silanol source compound. The method for producing the thermosetting resin composition includes a step of mixing the epoxy compound with the gallium compound and the silanol source compound. The method for producing a cured resin includes a step of heating an epoxy compound in the presence of a gallium compound and silanol. The method for causing self-polymerization of an epoxy compound is characterized by using a gallium compound and silanol as catalysts.