The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Feb. 09, 2012
Gerhard Kalkowski, Jena, DE;
Stefan Risse, Jena, DE;
Ramona Eberhardt, Bucha, DE;
Abstract
The invention relates to a method of producing lightweight structural elements which are produced as a composition construction element having at least one cover plate and one carrier element which are connected to one another. A carrier element, at which at least one apertures and/or at least one cut-out is/are formed and at least one further element, which is a cover plate, are connected to one another. A carrier element and at least one cover plate can be formed from a glass, a glass ceramic material, a ceramic material and/or silicon having an oxide surface layer which is formed at least in the bonding region of the elements to be connected to one another. The carrier element should have at least a double thickness with respect to the thickness of a cover plate. The surfaces of the cover plate(s) and of the carrier element to be connected to one another should be intensely cleaned in their bonding regions and should be smoothed such that a roughness of the surface is achieved there, such that they are in direct touching contact with at least 80% of their bonding surface with an active compression source and in this respect a thermal treatment is carried out at a temperature of at least 100° C. and maintaining of the temperature over a period of at least 0.5 h to establish a bond connection of the cover plate(s) and the carrier element. In this respect, at least one cover plate should be connected to a surface of the carrier element at which at least one opening of an aperture or of a cut-out is arranged.