The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Mar. 08, 2013
Applicant:

Toyo Seikan Group Holdings, Ltd., Shinagawa-ku, Tokyo, JP;

Inventors:

Makoto Sawada, Yokohama, JP;

Kiyotaka Shinozaki, Yokohama, JP;

Yoshiaki Shinagawa, Yokohama, JP;

Jun Yamasaki, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65B 7/00 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); C08J 5/00 (2006.01); B65D 39/00 (2006.01); B65D 41/00 (2006.01); B65D 43/00 (2006.01); B65D 47/00 (2006.01); B65D 51/00 (2006.01); B23K 26/00 (2014.01); B65B 51/10 (2006.01); B65B 7/28 (2006.01); B29C 65/16 (2006.01); B32B 38/00 (2006.01); B29K 507/04 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B65B 51/10 (2013.01); B29C 65/1635 (2013.01); B29C 65/1654 (2013.01); B29C 65/1677 (2013.01); B29C 66/1312 (2013.01); B29C 66/542 (2013.01); B29C 66/545 (2013.01); B29C 66/65 (2013.01); B29C 66/733 (2013.01); B29C 66/73921 (2013.01); B29C 66/91411 (2013.01); B29C 66/91443 (2013.01); B29C 66/91951 (2013.01); B29C 66/934 (2013.01); B29C 66/939 (2013.01); B32B 38/0008 (2013.01); B65B 7/28 (2013.01); B29C 65/1616 (2013.01); B29C 66/71 (2013.01); B29C 66/8322 (2013.01); B29K 2507/04 (2013.01); B29K 2995/0027 (2013.01); B29L 2031/716 (2013.01);
Abstract

A method of sealing a container and a lid by melt adhesion by laser. Either the container or the lid has a thermoplastic resin that permits the laser beam to transmit through and the other one has a resin composition of the thermoplastic resin containing a heat-generating substance. Further, the laser beam applies a rectangular beam having a uniform intensity distribution. The upper-limit of temperature is not lower than a melting point of the thermoplastic resin but lower than a thermal decomposition start temperature thereof in the melt adhesion interface between the container and the lid, and the temperature reaches the upper-limit in a heating time t (msec) represented by the following formula (1),(msec)=  (1)where L is the length (mm) of the rectangular beam in the scanning direction, and S is the rate of laser scanning (mm/msec) of not higher than 1.65 mm/msec.


Find Patent Forward Citations

Sawada, Makoto. (2017). Method of sealing containers and lids by melt adhesion by laser (U.S. Patent No. 9550596). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9550596

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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