The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Jun. 11, 2015
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Shiguma Kato, Yokohama, JP;
Yuichiro Fujiyama, Kobe, JP;
Takumi Takahashi, Yokkaichi, JP;
Taku Maruo, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/10 (2006.01); B24B 49/16 (2006.01); H01L 21/66 (2006.01); B24B 21/04 (2006.01);
U.S. Cl.
CPC ...
B24B 49/16 (2013.01); B24B 21/04 (2013.01); H01L 22/20 (2013.01);
Abstract
According to an embodiment, a polishing device includes a stage, a polishing unit, and a strain measuring unit. The stage is rotatable together with a semiconductor wafer. The polishing unit polishes the rear surface of the semiconductor wafer mounted on the stage beside the stage. The strain measuring unit measures a first strain that is a radial-direction strain of the semiconductor wafer and a second strain that is a circumferential-direction strain of the semiconductor wafer during the polishing.