The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9550252 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 24, 2017

Filed:

Sep. 13, 2013
Applicant:

Yazaki Corporation, Minato-ku, Tokyo, JP;

Inventor:

Yousuke Takayashiki, Susono, JP;

Assignee:

Yazaki Corporation, Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/06 (2006.01); B23K 20/10 (2006.01); H01R 4/02 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
B23K 20/10 (2013.01); B23K 20/106 (2013.01); H01R 4/023 (2013.01); H01R 43/0207 (2013.01);
Abstract

An ultrasonic jointing method is provided for performing an ultrasonic joint of a conductor part which is exposed by removing a coating of an electric wire with respect to a terminal. The ultrasonic jointing method includes: holding the conductor part of the electric wire and the terminal between an anvil and a horn in which a concave part is formed; and applying an ultrasonic vibration to the conductor part of the electric wire and the terminal that are held between the anvil and the horn. The conductor part is received in the concave part which has a space area of 0.89 to 1.46 times as large as a cross-sectional area of the conductor part of the electric wire.


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Takayashiki, Yousuke. (2017). Ultrasonic jointing method (U.S. Patent No. 9550252). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9550252

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