The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Nov. 25, 2013
Applicant:

Kobe Steel, Ltd., Kobe-shi, JP;

Inventors:

Naoki Ohba, Takasago, JP;

Hiroshi Tamagaki, Takasago, JP;

Assignee:

Kobe Steel, Ltd., Kobe-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 1/00 (2006.01); B05C 1/10 (2006.01); B05C 1/12 (2006.01); C23C 16/54 (2006.01); C23C 16/458 (2006.01); C23C 14/56 (2006.01); C23C 16/46 (2006.01); H05B 3/00 (2006.01); C23C 14/54 (2006.01); D21F 5/02 (2006.01);
U.S. Cl.
CPC ...
B05C 1/003 (2013.01); B05C 1/10 (2013.01); B05C 1/12 (2013.01); C23C 14/541 (2013.01); C23C 14/562 (2013.01); C23C 16/46 (2013.01); C23C 16/545 (2013.01); H05B 3/0095 (2013.01); D21F 5/022 (2013.01);
Abstract

Provided is a substrate transport roller () capable of ensuring a broad temperature-control region on a substrate, without reducing substrate transport quality. This substrate transport roller () is provided in a film-forming device () for executing a film-forming process on the surface of a film substrate (W), transports the film substrate (W) by rotating around a center axis, and is equipped with: a center-section segment () positioned in the center section in the axial direction extending along the center axis, and having a first outer-circumferential surface; end-section segments () positioned on both sides on the outside in the axial direction of the center-section segment (), and each having a second outer-circumferential surface which contacts the substrate (W) and has a larger diameter than that of the first outer-circumferential surface; a center-section-rising-falling-temperature-medium mechanism for changing the temperature of the center-section segment (); and a both-end-section-rising-falling-temperature mechanism for changing the temperature of each of the end-section segments () independently from the center-section segment ().


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