The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Feb. 28, 2012
Applicants:

Per Hillstrom, Molnlycke, SE;

Mikael Fardig, Lindome, SE;

Daniel Fredriksson, Jorlanda, SE;

Sofia Olsson, Goteborg, SE;

Inventors:

Per Hillstrom, Molnlycke, SE;

Mikael Fardig, Lindome, SE;

Daniel Fredriksson, Jorlanda, SE;

Sofia Olsson, Goteborg, SE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 5/02 (2006.01); B32B 38/00 (2006.01); H05K 5/06 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0213 (2013.01); B32B 38/0012 (2013.01); H05K 5/061 (2013.01); H05K 9/0018 (2013.01); B32B 2439/40 (2013.01); B32B 2457/00 (2013.01);
Abstract

The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part. The housing comprises at least one ventilation opening to prevent build-up of negative pressure inside the housing, where the ventilation opening is covered by a protective covering comprising a through opening. The through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. A method for manufacturing a housing according to the invention is also disclosed.


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