The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Dec. 12, 2012
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Chang Woo Yoo, Seoul, KR;
Yeong Uk Seo, Seoul, KR;
Byeong Ho Kim, Seoul, KR;
Hyun Seok Seo, Seoul, KR;
Sang Myung Lee, Seoul, KR;
Ki Do Chun, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 7/10 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 3/465 (2013.01); H05K 3/06 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/0353 (2013.01);
Abstract
Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.