The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Aug. 30, 2013
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Shayan Malek, San Jose, CA (US);

John B. Ardisana, II, San Francisco, CA (US);

Dhaval N. Shah, Fremont, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); H05K 1/141 (2013.01); H05K 3/36 (2013.01); H05K 1/115 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/10598 (2013.01); H05K 2203/061 (2013.01);
Abstract

The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.


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