The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
May. 20, 2015
Fujikura Ltd, Tokyo, JP;
Hirohito Watanabe, Sakura, JP;
Taiji Ogawa, Sakura, JP;
FUJIKURA LTD., Tokyo, JP;
Abstract
To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (); a first signal line (LA) that constitutes differential signal lines formed on the insulating substrate () and includes a curved portion; a second signal line (LB) provided along the first signal line (LA) and side by side inside the curved portion; and a ground layer () formed for the first signal line (LA) and the second signal line (LB) via an insulating material (). The ground layer () includes a first ground layer (GA) corresponding to a first region (D) and a second ground layer (GB) corresponding to a second region (D). The first region (D) is defined based on the first signal line (LA) and has a first predetermined width (WA). The second region (D) is defined based on the second signal line (LB) and has a second predetermined width (WB). The first ground layer (GA) has a remaining ratio lower than a remaining ratio of the second ground layer (GB).