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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9548471 B1

PDFFull Text
Date of Patent:
Jan. 17, 2017

Filed:

Jul. 15, 2015

Organic light emitting device and method of manufacturing the same

Applicant:

Lg Display Co., Ltd., Seoul, KR;

Inventor:

Chang Nam Kim, Paju-si, KR;

Assignee:

LG Display Co., Ltd., Seoul, KR;

Attorney:

Fenwick & West LLP

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Moin Rahman

Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 21/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01); G06F 1/16 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); G06F 1/1652 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); H01L 27/322 (2013.01); H01L 27/323 (2013.01); H01L 27/3246 (2013.01); H01L 27/3251 (2013.01); H01L 27/3272 (2013.01); H01L 51/5281 (2013.01); H01L 51/56 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01);
Abstract

Disclosed is an organic light emitting device and a method of manufacturing the same, wherein the organic light emitting device is decreased in its thickness, and also decreased in its radius of curvature so as to realize the flexible device, and the organic light emitting device comprising a first component including a first plurality of layers, the first plurality of layers including a thin film transistor layer deposited on a surface of a first substrate, an emitting component layer deposited on the thin film transistor layer, and a passivation layer deposited on the emitting component layer; a second component including a second plurality of layers that are deposited on a surface of a second substrate without using an adhesive; and an adhesion layer between the first component and the second component, the adhesion layer coupling together the first component and the second component.

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