The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Aug. 24, 2011
Applicants:

Makiko Kobayashi, Montreal, CA;

Cheng-kuei Jen, Brossard, CA;

Inventors:

Makiko Kobayashi, Montreal, CA;

Cheng-Kuei Jen, Brossard, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); H01L 41/047 (2006.01); G01N 29/34 (2006.01); H01L 41/187 (2006.01); H01L 41/318 (2013.01); H01L 41/08 (2006.01); H01L 41/331 (2013.01);
U.S. Cl.
CPC ...
H01L 41/0477 (2013.01); B06B 1/06 (2013.01); B06B 1/0688 (2013.01); G01N 29/34 (2013.01); H01L 41/0805 (2013.01); H01L 41/187 (2013.01); H01L 41/318 (2013.01); H01L 41/331 (2013.01); H01L 41/1876 (2013.01); Y10T 29/42 (2015.01);
Abstract

A piezoelectric film having a porosity between 20 and 40%, a thickness ranging from tens of microns to less than a few millimeters can be used to form an ultrasonic transducer UT for operation in elevated temperature ranges, that emit pulses having a high bandwidth. Such piezoelectric films exhibit greater flexibility allowing for conformation of the UT to a surface, and obviate the need for couplings or backings. Furthermore, a method of fabricating an UT having these advantages as well as better bonding between the piezoelectric film and electrodes involves controlling porosity within the piezoelectric film.


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