logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9548252 B1

PDFFull Text
Date of Patent:
Jan. 17, 2017

Filed:

Nov. 19, 2013

Reworkable epoxy resin and curative blend for low thermal expansion applications

Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Steven E. Lau, Harbor City, CA (US);

Steffanie S. Ung, Monterey Park, CA (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:

Lewis Roca Rothgerber Christie LLP

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); C08L 63/00 (2006.01); C08G 59/50 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); C08K 3/38 (2006.01); C08K 3/40 (2006.01); C08K 7/26 (2006.01); C08K 7/28 (2006.01); C08K 3/22 (2006.01); C08K 7/16 (2006.01); C08K 7/20 (2006.01); C09J 163/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 59/5033 (2013.01); C08K 3/22 (2013.01); C08K 3/40 (2013.01); C08K 7/16 (2013.01); C08K 7/20 (2013.01); C09J 163/00 (2013.01); H01L 21/563 (2013.01); H01L 23/3142 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 2003/2227 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A curable composition including: an epoxy resin; and an amine curing component including: an aromatic amine curing agent; and a solubilizer including an aliphatic amine, a cycloaliphatic amine, a non-volatile primary alcohol, non-volatile solvent or a mixture thereof. An electronic assembly including: a substrate; an underfill including a cured product of the curable composition on the substrate; and a ball grid array on the underfill is also disclosed.

Find Patent Forward Citations

Lau, Steven. (2017). Reworkable epoxy resin and curative blend for low thermal expansion applications (U.S. Patent No. 9548252). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9548252

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…