The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9548207 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 17, 2017

Filed:

Jul. 02, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yoshinao Ogata, Kawasaki, JP;

Masataka Kato, Hiratsuka, JP;

Masaya Uyama, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01L 21/30655 (2013.01); H01L 21/311 (2013.01); H01L 21/31105 (2013.01); H01L 21/31111 (2013.01);
Abstract

A method of etching a silicon substrate, in which a depressed portion is formed by etching a first surface of the silicon substrate with ions generated in plasma, the method including introducing a rare gas into a reaction system to ionize the rare gas.


Find Patent Forward Citations

Ogata, Yoshinao. (2017). Method of etching a silicon substrate (U.S. Patent No. 9548207). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9548207

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