The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Sep. 22, 2014
Applicant:

Dainippon Screen Mfg. Co., Ltd., Kyoto, JP;

Inventors:

Asuka Yoshizumi, Kyoto, JP;

Ayumi Higuchi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/04 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); B08B 3/00 (2006.01); B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02052 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); B08B 3/00 (2013.01); B08B 3/02 (2013.01); B08B 3/022 (2013.01); B08B 3/024 (2013.01); B08B 3/04 (2013.01);
Abstract

A substrate treatment method is provided, which includes a rinsing step of supplying a rinse liquid to a front surface of a rotating substrate after a chemical liquid step. The rinsing step includes a higher-speed rinsing step and a deceleration rinsing step to be performed after the higher-speed rinsing step. The deceleration rinsing step includes a liquid puddling step of reducing the rotation speed of the substrate within a rotation speed range lower than a rotation speed employed in the higher-speed rinsing step and supplying the rinse liquid to the front surface of the substrate at a flow rate higher than a maximum supply flow rate employed in the higher-speed rinsing step, whereby a puddle-like rinse liquid film is formed on the front surface of the substrate.


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