The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Jul. 25, 2015
Applicant:

Graftech International Holdings Inc., Brooklyn Heights, OH (US);

Inventors:

Alexander J. Augoustidis, Avon Lake, OH (US);

Gregory P. Kramer, Lyndhurst, OH (US);

Robert Anderson Reynolds, III, Bay Village, OH (US);

Assignee:

GrafTech International Holdings Inc., Brooklyn Heights, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); F21K 99/00 (2016.01); F21V 29/83 (2015.01); H05K 1/03 (2006.01); F21V 29/70 (2015.01); F21V 29/85 (2015.01); H05B 33/06 (2006.01); H05B 33/12 (2006.01); H05K 1/05 (2006.01); H05K 3/44 (2006.01); H05K 7/20 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
F21K 9/30 (2013.01); F21V 29/70 (2015.01); F21V 29/83 (2015.01); F21V 29/85 (2015.01); H05B 33/06 (2013.01); H05B 33/12 (2013.01); H05K 1/0203 (2013.01); H05K 1/032 (2013.01); H05K 1/056 (2013.01); H05K 3/44 (2013.01); H05K 7/20127 (2013.01); H05K 1/0207 (2013.01); H05K 1/0209 (2013.01); H05K 1/036 (2013.01); H05K 1/0393 (2013.01); H05K 1/092 (2013.01); H05K 3/245 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/1056 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10628 (2013.01);
Abstract

A flexible circuit board having a flexible graphite substrate is provided. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. Electronic components are mounted to the flexible circuit board to form a circuit arrangement. A thermally conductive conduit can be disposed in thermal and physical contact with a surface of the electronic component and the surface of the flexible graphite substrate to. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating electronic component and surrounding devices.


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