The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Apr. 30, 2014
Applicant:

Ihi Corporation, Tokyo, JP;

Inventors:

Yoji Okita, Tokyo, JP;

Chiyuki Nakamata, Tokyo, JP;

Seiji Kubo, Tokyo, JP;

Osamu Watanabe, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01D 5/18 (2006.01); F01D 9/04 (2006.01); F02C 7/12 (2006.01); F23R 3/06 (2006.01);
U.S. Cl.
CPC ...
F01D 5/186 (2013.01); F01D 9/041 (2013.01); F02C 7/12 (2013.01); F23R 3/06 (2013.01); F05D 2240/303 (2013.01); F05D 2260/202 (2013.01); F23R 2900/03042 (2013.01);
Abstract

The film cooling structure includes: a wall surface along which a heating medium flows; and at least one pair of film cooling holes that open at the wall surface and that blow a cooling medium. The pair of film cooling holes are arranged to be adjacent to each other in a main flow direction of the heating medium. In addition, perforation directions of the pair of film cooling holes are set such that directions of swirls of the cooling medium formed by blowing are opposite to each other, a swirl of the cooling medium on a downstream side in the main flow direction is mixed and merged with another swirl of the cooling medium on an upstream side in the main flow direction, and the merged cooling medium flows along the wall surface in a direction intersecting with the main flow direction.


Find Patent Forward Citations

Loading…