The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Dec. 16, 2013
Applicants:
Boe Technology Group Co., Ltd., Beijing, CN;
Beijing Boe Display Technology Co., Ltd., Beijing, CN;
Assignees:
BOE Technology Group Co., Ltd., Beijing, CN;
Beijing BOE Display Technology Co., Ltd., Beijing, CN;
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 16/40 (2006.01); C23C 14/08 (2006.01); C23C 14/22 (2006.01); C23C 4/00 (2016.01); G02F 1/1343 (2006.01); C23C 4/06 (2016.01); C23C 4/12 (2016.01); C23C 4/18 (2006.01); C23C 4/10 (2016.01); C23C 14/00 (2006.01); C23C 16/00 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01); C23C 16/56 (2006.01); C23C 14/02 (2006.01); B08B 11/00 (2006.01); B05D 7/00 (2006.01); B05D 5/00 (2006.01); B05D 1/02 (2006.01); B05D 1/08 (2006.01); B05D 3/10 (2006.01); B05D 1/10 (2006.01); G02F 1/13 (2006.01);
U.S. Cl.
CPC ...
C23C 16/44 (2013.01); C23C 4/00 (2013.01); C23C 4/06 (2013.01); C23C 4/10 (2013.01); C23C 4/11 (2016.01); C23C 4/12 (2013.01); C23C 4/123 (2016.01); C23C 4/129 (2016.01); C23C 4/18 (2013.01); C23C 14/00 (2013.01); C23C 14/021 (2013.01); C23C 14/024 (2013.01); C23C 14/08 (2013.01); C23C 14/081 (2013.01); C23C 14/082 (2013.01); C23C 14/083 (2013.01); C23C 14/085 (2013.01); C23C 14/086 (2013.01); C23C 14/087 (2013.01); C23C 14/088 (2013.01); C23C 14/22 (2013.01); C23C 14/34 (2013.01); C23C 14/5873 (2013.01); C23C 16/00 (2013.01); C23C 16/40 (2013.01); C23C 16/401 (2013.01); C23C 16/402 (2013.01); C23C 16/403 (2013.01); C23C 16/404 (2013.01); C23C 16/405 (2013.01); C23C 16/406 (2013.01); C23C 16/407 (2013.01); C23C 16/408 (2013.01); C23C 16/409 (2013.01); C23C 16/56 (2013.01); G02F 1/13439 (2013.01); B05D 1/02 (2013.01); B05D 1/08 (2013.01); B05D 1/10 (2013.01); B05D 3/105 (2013.01); B05D 3/107 (2013.01); B05D 5/00 (2013.01); B05D 7/50 (2013.01); B05D 7/52 (2013.01); B05D 7/56 (2013.01); G02F 2001/1316 (2013.01); Y10T 428/24752 (2015.01);
Abstract
A method of forming a film layer and a substrate comprising the film layer to reduce occurrence of defects and improve the quality of the film layer are described. The method of forming a film layer comprises forming a plurality of sub-film layers of a same material overlapped with each other on a substrate by multiple steps to constitute the film layer, wherein each time a sub-film layer is formed, the newly-formed sub-film layer is cleaned immediately. The substrate comprises a film layer formed by the above method.