The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Oct. 14, 2015
Applicant:
Memsensing Microsystems Co., Ltd., Suzhou, CN;
Assignee:
MEMSensing Microsystems Co., Ltd., Suzhou, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/08 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0058 (2013.01); B81C 1/00325 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/03 (2013.01); B81B 2207/07 (2013.01); B81C 2203/0136 (2013.01); B81C 2203/0792 (2013.01);
Abstract
According to an embodiment of the present invention, a pressure sensor includes: a pressure sensing chip, which includes a substrate, a sensing film, an insulation layer and a first bonding pad; wherein the sensing film is on the substrate, and a sagging step is formed at one side of the substrate; the insulation layer is prepared on the sensing film and the substrate; the first bonding pad is prepared on the insulation layer on a bottom surface of the step, and is connected to the region of the substrate close to the sensing film via a lead wire.