The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Sep. 29, 2014
Applicant:

Makerbot Industries, Llc, Brooklyn, NY (US);

Inventors:

Joseph Sadusk, New York, NY (US);

Filipp Gelman, Staten Island, NY (US);

Andrey V. Patrov, Brooklyn, NY (US);

Assignee:

MakerBot Industries, LLC, Brooklyn, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2006.01); B29C 47/00 (2006.01); B29C 47/80 (2006.01); B29C 47/82 (2006.01); B29C 47/92 (2006.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B23K 20/00 (2006.01); B23K 1/19 (2006.01); B33Y 80/00 (2015.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0092 (2013.01); B29C 47/0002 (2013.01); B29C 47/802 (2013.01); B29C 47/822 (2013.01); B29C 47/92 (2013.01); B29C 67/0051 (2013.01); B29C 67/0088 (2013.01); B23K 1/19 (2013.01); B23K 20/00 (2013.01); B29C 2947/926 (2013.01); B29C 2947/9258 (2013.01); B29C 2947/92571 (2013.01); B29C 2947/92904 (2013.01); B29L 2009/00 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); Y02P 90/265 (2015.11); Y10T 428/31786 (2015.04); Y10T 428/31913 (2015.04);
Abstract

Multi-material, three-dimensional fabrication is improved by the use of a purge wall adjacent to an object to absorb transitional artifacts of material changes. The structure of the purge wall may be selected to reduce build time, and to reduce certain printing artifacts such as warping and delaminating. For example, alternating layers of offset or mirrored zigzag patterns may be used to reduce and distribute the layer-to-layer adhesion surfaces throughout the purge wall while providing sufficient contact points to maintain the structural integrity of the purge wall.


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