The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Sep. 28, 2010
Applicants:

Brandon C. Hamilton, Marion, IA (US);

Guy N. Smith, Cedar Rapids, IA (US);

Alan P. Boone, Swisher, IA (US);

Inventors:

Brandon C. Hamilton, Marion, IA (US);

Guy N. Smith, Cedar Rapids, IA (US);

Alan P. Boone, Swisher, IA (US);

Assignee:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 7/02 (2006.01); H05K 7/04 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0081 (2013.01); H05K 9/0083 (2013.01); H01L 23/295 (2013.01); H05K 9/009 (2013.01); H05K 9/0024 (2013.01); H05K 9/0088 (2013.01);
Abstract

An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.


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