The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Feb. 02, 2015
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Toshiyuki Fukuda, Kyoto, JP;
Keisuke Kodera, Hyogo, JP;
Fumito Itou, Osaka, JP;
Toshihiro Miyoshi, Osaka, JP;
Assignee:
PANASONIC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/13 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H01L 23/13 (2013.01); H01L 23/345 (2013.01); H01L 23/3677 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/97 (2013.01); H01L 25/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15162 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19105 (2013.01);
Abstract
An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.