The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Nov. 27, 2013
Applicants:

Madhumitha Rengarajan, Camp Hill, PA (US);

Jan DE Geest, Wetteren, BE;

Stephen B. Smith, Mechanicsburg, PA (US);

Stefaan Hendrik Jozef Sercu, Wuustwezel, BE;

Inventors:

Madhumitha Rengarajan, Camp Hill, PA (US);

Jan De Geest, Wetteren, BE;

Stephen B. Smith, Mechanicsburg, PA (US);

Stefaan Hendrik Jozef Sercu, Wuustwezel, BE;

Assignees:

FCI Americas Technology LLC, Carson City, NV (US);

FCI Asia Pte. Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); H05K 1/0222 (2013.01); H05K 1/0251 (2013.01); H05K 2201/09636 (2013.01); H05K 2201/09718 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/0242 (2013.01);
Abstract

An electrical connector footprint on a printed circuit board (PCB) can include vias and antipads surrounding those vias. While conventional antipads surrounding vias are large in order to improve impedance of the PCB, the presence of the antipads can compromise the integrity of the ground plane and can permit cross talk to arise between differential pairs on different layers in the PCB. Antipads can be constructed and arranged so as to limit cross talk between layers in a PCB, while also maximizing impedance.


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