The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Nov. 18, 2013
Applicant:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Inventor:
Bang Hyun Kim, Ansan-si, KR;
Assignee:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B 15/05 (2006.01); H01L 33/54 (2010.01); H04N 5/225 (2006.01); F21V 5/04 (2006.01); F21V 9/16 (2006.01); F21V 23/00 (2015.01); F21V 33/00 (2006.01); H01L 33/58 (2010.01); F21W 131/40 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H04N 5/2256 (2013.01); F21V 5/048 (2013.01); F21V 9/16 (2013.01); F21V 23/005 (2013.01); F21V 33/0052 (2013.01); G03B 15/05 (2013.01); H01L 33/58 (2013.01); F21W 2131/40 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A light-emitting device includes a board, a light-emitting diode chip disposed on the board, a molding part disposed on the board and covering the light-emitting diode chip, and a lens cap disposed on the board that is coupled with the substrate thereon and covering the molding part. An air gap is disposed between the lens cap and the molding part.