The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

May. 27, 2013
Applicant:

Tesa SE, Hamburg, DE;

Inventors:

Minyoung Bai, Hamburg, DE;

Jan Ellinger, Hamburg, DE;

Judith Grünauer, Hamburg, DE;

Klaus Keite-Telgenbüscher, Hamburg, DE;

Anika Petersen, Bimöhlen, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/56 (2006.01); C09J 7/00 (2006.01); C09J 7/02 (2006.01); C09J 11/04 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); C09J 153/00 (2006.01); C09J 153/02 (2006.01); C09J 157/02 (2006.01); C09J 163/00 (2006.01); C09J 177/06 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); C09J 7/00 (2013.01); C09J 7/02 (2013.01); C09J 7/0203 (2013.01); C09J 7/0207 (2013.01); C09J 11/04 (2013.01); H01L 51/0096 (2013.01); H01L 51/5253 (2013.01); H01L 51/5259 (2013.01); C09J 153/005 (2013.01); C09J 153/02 (2013.01); C09J 157/02 (2013.01); C09J 163/00 (2013.01); C09J 177/06 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2400/22 (2013.01); C09J 2453/00 (2013.01); C09J 2463/00 (2013.01); C09J 2477/00 (2013.01); H01L 51/5246 (2013.01); H01L 2924/16195 (2013.01); Y02E 10/549 (2013.01);
Abstract

The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.


Find Patent Forward Citations

Loading…